Applications

When to use

Use when your battery enclosure, mounting strategy, or module protection concept is still evolving and validation risk is high.

What we do

• Load-case definition for crash, drop, and shock scenarios
• Structural response analysis for pack, module, and interface regions
• Critical failure-path identification and design recommendations
• Test-aligned simulation setup for faster correlation cycles

Typical timeline

2-4 weeks for scoped work packages

What you receive

• Risk-ranked load-case matrix
• Model package with documented assumptions
• Design change recommendations with trade-offs
• Decision memo for management and test teams

Inputs needed

• CAD or envelope geometry
• Material assumptions or available test data
• Target load cases and boundary conditions
• Program phase and decision deadlines

When to use

Use when temperature uniformity, hotspot risk, or thermal runaway concerns are influencing architecture decisions.

What we do

• Thermal boundary setup and operating envelope definition
• Temperature distribution and hotspot mapping
• Cooling path effectiveness studies
• Thermal risk prioritization for design and test

Typical timeline

2-5 weeks depending on model maturity

What you receive

• Thermal risk map and scenario summary
• Cooling concept comparison report
• Validation-oriented assumptions register
• Action list for next design/test cycle

Inputs needed

• Cell/module heat assumptions
• Pack layout and cooling concept data
• Operating and ambient boundary ranges
• Test intent and acceptance criteria

When to use

Use when crash performance, packaging constraints, and mass targets compete in the same design window.

What we do

• Impact load-path interpretation and weak-link mapping
• Energy absorption and deformation mode assessment
• Targeted concept comparisons for reinforcement strategy
• Design-to-test alignment for crash programs

Typical timeline

3-6 weeks for multi-concept studies

What you receive

• Load-path and deformation behavior report
• Prioritized concept options with rationale
• Simulation evidence package for design reviews
• Executive-ready decision brief

Inputs needed

• Geometry variants and interface constraints
• Material model assumptions
• Impact conditions and program targets
• Mass or packaging constraints

When to use

Use when solder fatigue, thermal cycling, or package stress may drive field reliability concerns.

What we do

• Thermal cycling and stress concentration evaluation
• Reliability hotspot identification on critical interconnects
• Package-level thermo-mechanical sensitivity studies
• Guidance for correlation with reliability testing

Typical timeline

2-4 weeks for focused reliability questions

What you receive

• Reliability risk map for critical regions
• Scenario comparison report
• Assumption and uncertainty log
• Recommended design/test actions

Inputs needed

• Component/package geometry or equivalent abstraction
• Thermal profile and mission assumptions
• Material properties and known constraints
• Reliability target criteria

When to use

Use when material behavior uncertainty limits confidence in crash, durability, or thermal-structural predictions.

What we do

• Model strategy selection for intended physics
• Parameter calibration workflow design
• Failure initiation/propagation representation strategy
• Model verification and practical usage guidance

Typical timeline

3-8 weeks based on data readiness

What you receive

• Material model definition package
• Calibration and validation documentation
• Solver setup notes and best-practice guardrails
• Handover briefing for internal analysts

Inputs needed

• Available test datasets or expected test plan
• Target solver and application context
• Required fidelity and turnaround expectations
• Design decisions dependent on the model